Electronics & PCB Manufacturing (Semiconductors & Components)

Plasma Cleaners / Etchers Operator & Technician Training Offered by Pertecnica Engineering Plasma Cleaners and Etchers are advanced surface treatment systems used in electronics and precision manufacturing to remove contaminants, activate surfaces, and perform micro-level etching. These machines utilize ionized gas (plasma) to clean organic residues, improve adhesion, and modify surface properties without damaging the ... Read more

Molding Machines (Semiconductor Packaging) Operator & Technician Training Offered by Pertecnica Engineering Molding Machines used in semiconductor packaging are specialized systems designed to encapsulate semiconductor devices using epoxy molding compounds. These machines protect delicate electronic components such as chips and wire bonds from environmental damage, mechanical stress, and contamination. Common systems include transfer molding and ... Read more

Stencil Printers Operator & Technician Training Offered by Pertecnica Engineering Stencil Printers are critical machines used in PCB assembly for applying solder paste onto printed circuit boards with high precision. These machines use a stencil (metal mask) to deposit controlled amounts of solder paste onto specific pad locations before component placement. Modern stencil printers are ... Read more

Aerosol Jet Printers Operator & Technician Training Offered by Pertecnica Engineering Aerosol Jet Printers are advanced additive manufacturing systems used for printing fine electronic circuits, sensors, and functional materials onto a wide range of substrates. These machines atomize liquid inks into micro-droplets and precisely deposit them through a focused aerosol stream, enabling high-resolution printing on ... Read more

Conformal Coating Machines Operator & Technician Training Offered by Pertecnica Engineering Conformal Coating Machines are specialized systems used in electronics manufacturing to apply protective coatings on printed circuit boards (PCBs) and electronic assemblies. These coatings protect components from moisture, dust, chemicals, temperature variations, and environmental stress. Modern conformal coating machines use automated spray, dip, or ... Read more

In-Circuit Testers (ICT) Operator & Technician Training Offered by Pertecnica Engineering In-Circuit Testers (ICT) are essential testing systems used in PCB assembly to verify the functionality and integrity of individual electronic components and circuits on a board. These machines perform electrical tests such as continuity, resistance, capacitance, and component presence, ensuring that assembled PCBs meet ... Read more

Flying Probe Testers Operator & Technician Training Offered by Pertecnica Engineering Flying Probe Testers are advanced PCB testing systems used to verify electrical performance without the need for dedicated fixtures. These machines use movable probes to contact test points on a PCB, enabling flexible and accurate testing of prototypes, small batches, and complex boards. Flying ... Read more

X-Ray Inspection Systems Operator & Technician Training Offered by Pertecnica Engineering X-Ray Inspection Systems are advanced non-destructive testing (NDT) machines used in electronics and precision manufacturing to inspect internal structures of components without disassembly. These systems are widely used in PCB assembly to detect hidden defects such as solder voids, BGA (Ball Grid Array) joint ... Read more

Automated Optical Inspection (AOI) Machines Operator & Technician Training Offered by Pertecnica Engineering Automated Optical Inspection (AOI) Machines are advanced quality control systems used in PCB assembly to detect defects using high-resolution cameras and image processing software. These machines inspect components, solder joints, and PCB surfaces to identify issues such as misalignment, missing components, solder ... Read more

Wafer Dicing Saws Operator & Technician Training Offered by Pertecnica Engineering Wafer Dicing Saws are precision cutting systems used in semiconductor manufacturing to separate silicon wafers into individual chips (dies). These machines use high-speed rotating blades or laser-assisted systems to achieve clean, accurate cuts without damaging delicate semiconductor structures. Wafer dicing is a critical step ... Read more