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Laser Powder Bed Fusion (Metal 3D Printers) Operator & Technician Training Offered by Pertecnica Engineering Laser Powder Bed Fusion (LPBF) is an advanced metal additive manufacturing technology used to produce highly precise and complex components layer by layer. Using a high-power laser, LPBF selectively melts metal powders to create fully dense parts with intricate geometries…
Ultrasonic Consolidation Machines Operator & Technician Training Offered by Pertecnica Engineering Ultrasonic Consolidation (UC) Machines are advanced additive manufacturing systems used to produce metal components by bonding thin metal foils layer by layer using ultrasonic vibrations. This solid-state process allows the creation of lightweight, complex, and hybrid metal parts without melting, reducing thermal stresses and…
Composite Automated Tape Layers (ATL) Operator & Technician Training Offered by Pertecnica Engineering Automated Tape Layer (ATL) machines are advanced composite manufacturing systems used to lay continuous carbon or glass fiber tapes onto molds or mandrels with high precision. This process enables the production of large, lightweight, and high-strength composite parts for aerospace, automotive, and…
Composite Automated Fiber Placement (AFP) Operator & Technician Training Offered by Pertecnica Engineering Automated Fiber Placement (AFP) machines are advanced composite manufacturing systems used to lay continuous carbon or glass fibers onto molds or mandrels with high precision and speed. AFP enables the creation of large, lightweight, and high-strength composite components with complex geometries, optimized…
Plasma Cleaners / Etchers Operator & Technician Training Offered by Pertecnica Engineering Plasma Cleaners and Etchers are advanced surface treatment systems used in electronics and precision manufacturing to remove contaminants, activate surfaces, and perform micro-level etching. These machines utilize ionized gas (plasma) to clean organic residues, improve adhesion, and modify surface properties without damaging the…
Molding Machines (Semiconductor Packaging) Operator & Technician Training Offered by Pertecnica Engineering Molding Machines used in semiconductor packaging are specialized systems designed to encapsulate semiconductor devices using epoxy molding compounds. These machines protect delicate electronic components such as chips and wire bonds from environmental damage, mechanical stress, and contamination. Common systems include transfer molding and…
Stencil Printers Operator & Technician Training Offered by Pertecnica Engineering Stencil Printers are critical machines used in PCB assembly for applying solder paste onto printed circuit boards with high precision. These machines use a stencil (metal mask) to deposit controlled amounts of solder paste onto specific pad locations before component placement. Modern stencil printers are…
Aerosol Jet Printers Operator & Technician Training Offered by Pertecnica Engineering Aerosol Jet Printers are advanced additive manufacturing systems used for printing fine electronic circuits, sensors, and functional materials onto a wide range of substrates. These machines atomize liquid inks into micro-droplets and precisely deposit them through a focused aerosol stream, enabling high-resolution printing on…
Conformal Coating Machines Operator & Technician Training Offered by Pertecnica Engineering Conformal Coating Machines are specialized systems used in electronics manufacturing to apply protective coatings on printed circuit boards (PCBs) and electronic assemblies. These coatings protect components from moisture, dust, chemicals, temperature variations, and environmental stress. Modern conformal coating machines use automated spray, dip, or…
In-Circuit Testers (ICT) Operator & Technician Training Offered by Pertecnica Engineering In-Circuit Testers (ICT) are essential testing systems used in PCB assembly to verify the functionality and integrity of individual electronic components and circuits on a board. These machines perform electrical tests such as continuity, resistance, capacitance, and component presence, ensuring that assembled PCBs meet…