#702, 7th Floor, Dega Towers, Rajbhavan Road, Somajiguda, Hyderabad - 500082
Flying Probe Testers Operator & Technician Training Offered by Pertecnica Engineering Flying Probe Testers are advanced PCB testing systems used to verify electrical performance without the need for dedicated fixtures. These machines use movable probes to contact test points on a PCB, enabling flexible and accurate testing of prototypes, small batches, and complex boards. Flying…
X-Ray Inspection Systems Operator & Technician Training Offered by Pertecnica Engineering X-Ray Inspection Systems are advanced non-destructive testing (NDT) machines used in electronics and precision manufacturing to inspect internal structures of components without disassembly. These systems are widely used in PCB assembly to detect hidden defects such as solder voids, BGA (Ball Grid Array) joint…
Automated Optical Inspection (AOI) Machines Operator & Technician Training Offered by Pertecnica Engineering Automated Optical Inspection (AOI) Machines are advanced quality control systems used in PCB assembly to detect defects using high-resolution cameras and image processing software. These machines inspect components, solder joints, and PCB surfaces to identify issues such as misalignment, missing components, solder…
Wafer Dicing Saws Operator & Technician Training Offered by Pertecnica Engineering Wafer Dicing Saws are precision cutting systems used in semiconductor manufacturing to separate silicon wafers into individual chips (dies). These machines use high-speed rotating blades or laser-assisted systems to achieve clean, accurate cuts without damaging delicate semiconductor structures. Wafer dicing is a critical step…
Die Bonders Operator & Technician Training Offered by Pertecnica Engineering Die Bonders are precision machines used in semiconductor packaging to attach semiconductor dies (chips) onto substrates, lead frames, or packages using adhesives, solder, or eutectic bonding methods. These machines ensure accurate placement, strong bonding, and high reliability of electronic components. Modern die bonding systems are…
Wire Bonders Operator & Technician Training Offered by Pertecnica Engineering Wire Bonders are precision machines used in semiconductor packaging to create electrical connections between a semiconductor die and its package or substrate using fine wires (typically gold, aluminum, or copper). These machines perform highly accurate bonding processes such as ball bonding and wedge bonding, ensuring…
Wave Soldering Machines Operator & Technician Training Offered by Pertecnica Engineering Wave Soldering Machines are widely used in PCB assembly for soldering through-hole components by passing the board over a wave of molten solder. This process ensures reliable and consistent solder joints for multiple components in a single pass, making it highly efficient for mass…
Reflow Ovens Operator & Technician Training Offered by Pertecnica Engineering Reflow Ovens are critical machines used in PCB assembly for soldering surface mount components by heating solder paste to form reliable electrical connections. These ovens use controlled temperature zones to gradually heat, reflow, and cool the PCB, ensuring precise and consistent soldering without damaging components.…
Pick-and-Place Machines Operator & Technician Training Offered by Pertecnica Engineering Pick-and-Place Machines are core systems in SMT (Surface Mount Technology) lines used for automatically placing electronic components onto printed circuit boards (PCBs) with high speed and precision. These machines use robotic heads, vision systems, and feeders to accurately pick components from reels or trays and…
PCB Routing & Milling Machines Operator & Technician Training Offered by Pertecnica Engineering PCB Routing & Milling Machines are precision machining systems used to cut, shape, and separate printed circuit boards (PCBs) from panels and to perform fine milling operations such as slotting, contouring, and drilling. These machines are essential in PCB manufacturing and prototyping…